Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions-Reference-Cited by-同舟云学术

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Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions

Published:2024-05-28 Issue: Volume: Page:1538-1542
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Lai Yangyang¹,X Jiefeng¹,Ha Jonghwan¹,Deo Karthik A¹,Yang Junbo¹,Park Seungbae¹

Affiliation:

1. Binghamton University,Mechanical Engineering,Vestal,NY,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564926.pdf?arnumber=10564926

Reference23 articles.

1. 3D Packaging for Heterogeneous Integration

2. Present and future thermal interface materials for electronic devices

3. A comparison study of TIM degradation of phase change material and thermal grease

4. Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

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