Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive-Reference-Cited by-同舟云学术

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Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
language:
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Author:

Choi Kwang-Seong,Joo Jiho,Eom Yong-Sung,Choi Gwang-Mun,Jang Ki-seok,Lee Chanmi,Moon Seok Hwan,Yun Ho-Gyeong,Choi Ji-Hoon,Choi Ji-Woong

Funder

National Research Foundation of Korea (NRF)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501671.pdf?arnumber=9501671

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent progress of laser processing technology in micro-LED display manufacturing: A review;Optics & Laser Technology;2025-02

2. Tailoring peel strength in UV-responsive, nonconductive adhesives via photocleavable epoxy for micro-LED bonding and repair;Materials Today Communications;2024-06

3. Development of Nanopillar Arrays Nanopatterning Without Lift‐Off for Transferable GaN‐Based µLEDs;Advanced Materials Technologies;2024-05-25

4. Application of metal interconnection process with micro-LED display by laser-assisted bonding technology;Journal of Materials Science: Materials in Electronics;2023-12

5. Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer;2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-11-27

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