Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer-Reference-Cited by-同舟云学术

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Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Published:2023-11-27 Issue: Volume: Page:365-368
ISSN:
Container-title:2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)
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Author:

Ji Liangzheng¹,Li Zaihuan²,Wang Xin²,Zhang Guoqi³,Zhang Jing²,Liu Pan¹

Affiliation:

1. Fudan University,Faculty of Academy for Engineering and Technology,Shanghai,China

2. Heraeus Material Technology Shanghai Ltd.,Shanghai,China

3. Electronic Components, Technology, and Materials, Delft University of Technology Delft,Netherlands

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10399638/10399484/10399660.pdf?arnumber=10399660

Reference15 articles.

1. Growth, transfer printing and colour conversion techniques towards full-colour micro-LED display

2. Micro-LEDs, a Manufacturability Perspective

3. Recent Progress in Micro‐LED‐Based Display Technologies

4. An Alternative Micro LED Mass Transfer Technology: Self-Assembly

5. Concurrent self-assembly of RGB microLEDs for next-generation displays

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Molecular Dynamics Simulation Study of Interface Material in Micro LEDs Self-assembly Process;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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