Thermal-Aware EM Reliability for Advanced Metal Interconnects of Complementary FET-Reference-Cited by-同舟云学术

Thermal-Aware EM Reliability for Advanced Metal Interconnects of Complementary FET

Published:2022-05 Issue:5 Volume:69 Page:2573-2578
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Cai Linlin¹^ORCID,Zheng Mingyue¹,Lyu Yaoyang¹,Chen Wangyong¹^ORCID

Affiliation:

1. Guangdong Provincial Key Laboratory of Optoelectronic Information Processing Chips and Systems and the School ofMicroelectronics Science and Technology, Sun Yat-sen University, Guangzhou, China

Funder

Youth Fund of Guangdong Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/9761777/09738725.pdf?arnumber=9738725

Reference28 articles.

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2. BEOL reliability challenges;li;Proc IEEE Int Rel Phys Symp Tutorials,2016

3. Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

4. Device-, Circuit- & Block-level evaluation of CFET in a 4 track library

5. A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options Done by Virtual Fabrication

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