A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss-Reference-Cited by-同舟云学术

A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss

Published:2022-12 Issue:12 Volume:69 Page:6922-6928
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Li Hui¹^ORCID,Zhou Bailing¹^ORCID,Yao Ran¹^ORCID,Lai Wei¹^ORCID,Chen Xianping¹^ORCID,Liu Renkuan¹^ORCID,Chen Zhongyuan²,Wang Miaorui³

Affiliation:

1. State Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China

2. State Key Laboratory of Advanced Power Transmission Technology, Beijing, China

3. Electric Power Research Institute, State Grid Chongqing Electric Power Company, Chongqing, China

Funder

National Natural Science Foundation of China–State Grid Corporation Joint Fund for Smart Grid

Science and Technology Project of State Grid Corporation of China

State Key Laboratory of Advanced Power Transmission Technology

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/9967813/09941059.pdf?arnumber=9941059

Reference16 articles.

1. Application of reduced-order models based on PCA & Kriging for the development of digital twins of reacting flow applications

2. A Digital Twin Based Estimation Method for Health Indicators of DC–DC Converters

3. Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition

4. Proper-Orthogonal-Decomposition Based Thermal Modeling of Semiconductor Structures

5. The Time-Domain Vector Fitting Algorithm for Linear Macromodeling

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