Defect-Based Empirical Model for On-State Degradation in Sub-20-nm DRAM Periphery pFETs Under Arbitrary Condition

Author:

Wang Da1ORCID,Zhou Longda1,Xue Yongkang1ORCID,Ren Pengpeng1,Zhang Lining2ORCID,Li Xiong3,Liu Xiangli3,Wang Jianping3,Wu Blacksmith3,Ji Zhigang1ORCID,Wang Runsheng2ORCID,Cao Kanyu3,Huang Ru2

Affiliation:

1. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Shanghai Jiaotong University, Shanghai, China

2. School of Integrated Circuits, Peking University, Beijing, China

3. ChangXin Memory Technologies, Hefei, China

Funder

National Key Research and Development Program of China

National NSF of China

111 Projects

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. The defect-centric perspective of device and circuit reliability—From gate oxide defects to circuits

2. Characterization and modelling of hot carrier degradation in pFETs under Vd>Vg condition for sub-20 nm DRAM technologies;wang;Proc IEEE Int Rel Phys Symp (IRPS),2022

3. Hot Carrier Degradation in Semiconductor Devices

4. CMOS hot carrier: From physics to end of life projections, and qualification;rauch;Proc IEEE Int Rel Phys Symp (IRPS),2010

5. Overcoming the reliability limitation in the ultimately scaled DRAM using silicon migration technique by hydrogen annealing

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