Fabrication of 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Arrays on Insulating Substrates With Through-Wafer Interconnects Using Sacrificial Release Process-Reference-Cited by-同舟云学术

Fabrication of 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Arrays on Insulating Substrates With Through-Wafer Interconnects Using Sacrificial Release Process

Published:2020-08 Issue:4 Volume:29 Page:553-561
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Adelegan Oluwafemi J.^ORCID,Coutant Zachary A.^ORCID,Zhang Xiao^ORCID,Yamaner Feysel Yalcin^ORCID,Oralkan Omer^ORCID

Funder

National Institute of Health

Defense Advanced Research Projects Agency

National Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://ieeexplore.ieee.org/ielam/84/9153185/9088227-aam.pdf

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5. Design of CMUT Cells for High-intensity Focused Ultrasound Applications;2022 IEEE International Conference of Electron Devices Society Kolkata Chapter (EDKCON);2022-11-26