Temperature Dependence Modeling and Thermal Sensitivity Reduction of Bulk Micromachined Silicon MEMS Lamé Resonators
Author:
Affiliation:
1. Department of Electrical Engineering, École de Technologie Supérieure, Université du Québec, Montréal, Canada
Funder
Natural Sciences and Engineering Research Council of Canada
Canadian Microelectronics Corporation (CMC) Microsystems and Microfabrication Technology Access
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
http://xplorestaging.ieee.org/ielx7/84/10198872/10146408.pdf?arnumber=10146408
Reference47 articles.
1. Passive TCF compensation in high Q silicon micromechanical resonators
2. A Sub-mW 18-MHz MEMS Oscillator Based on a 98-dBΩ Adjustable Bandwidth Transimpedance Amplifier and a Lamé-Mode Resonator
3. Analytical modeling of n-type doped silicon elastic constants and frequency-compensation of Lamé mode microresonators
4. A Digitally Programmable CMOS Feedback ASIC for Highly Stable MEMS-Referenced Oscillators
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1. Equivalent Circuit Modeling of Air-Coupled Laterally Actuated Electrostatic Bulk-Mode MEMS;IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control;2024
2. Precision Temperature Control of Microsystems using On-Package Heaters and Sensors;2023 IEEE SENSORS;2023-10-29
3. Recent Advances in Bio-MEMS and Future Possibilities: An Overview;Journal of The Institution of Engineers (India): Series B;2023-10-04
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