Design and Implementation of High Precision and High Density Capacitor based on Silicon Integrated Passive Device Technology-Reference-Cited by-同舟云学术

Design and Implementation of High Precision and High Density Capacitor based on Silicon Integrated Passive Device Technology

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Wang Qiangwen¹,Guo Yuhua²

Affiliation:

1. China Electronics Technology Group, Corporation, Anhui Province Engineering, Laboratory for Antennas and Microwave,The 38th Research Institute,Hefei,China

2. China Electronics Technology Group, Corporation, Key Lab of Aperture Array and Space, Application (KLAASA),The 38th Research Institute,Hefei,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873352.pdf?arnumber=9873352

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5. On-wafer probing measurement and optimization of MIM capacitors for integrated passive device application;lin;7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT),2012

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