Sintering of hollow Ag particle paste on bare Cu substrate for die attachment under a nitrogen atmosphere-Reference-Cited by-同舟云学术

Sintering of hollow Ag particle paste on bare Cu substrate for die attachment under a nitrogen atmosphere

Published:2022-08-10 Issue: Volume: Page:
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Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Guo Rumeng¹,Zhou Shiqi¹,Gao Yue¹,Liu Zhi-Quan²,Sun Rong²

Affiliation:

1. Chinese Academy of Sciences (CAS),Shenzhen Institute of Advanced Electronic Materials (SIEM), Shenzhen Institute of Advanced Technology (SIAT),Shenzhen,China,518055

2. CAS,Shenzhen Institute of Advanced Electronic Materials (SIEM), Shenzhen Institute of Advanced Technology (SIAT),Shenzhen,China,518055

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872583.pdf?arnumber=9872583

Reference17 articles.

1. Microstructural stability of Ag sinter joining in thermal cycling

2. Molecular dynamics study of neck growth in laser sintering of hollow silver nanoparticles with different heating rates

3. A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization;le;Microelectron Reliab,2012

4. Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates

5. Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

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