Reliability Study of WLP for IPD with Through Glass Vias Vertical Interconnection-Reference-Cited by-同舟云学术

Reliability Study of WLP for IPD with Through Glass Vias Vertical Interconnection

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhao Jin¹,Qin Fei¹,Yu Daquan²,Chen Zuohuan³

Affiliation:

1. Beijing University of Technology,Faculty of Materials and Manufacturing,Beijing,China

2. Xiamen University Xiamen Sky Semiconductor,School of Electronic Science and Engineering,Xiamen,China

3. Xiamen Sky Semiconductor Technology Co.Ltd,Xiamen,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873383.pdf?arnumber=9873383

Reference8 articles.

1. Thermo-mechanical reliability of copper-filled and polymer-filled through silicon vias in 3D interconnects

2. Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling

3. The interfacial reliability of through-glass vias for 2.5D integrated circuits

4. Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

5. Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter;chen;SENSORS,2114

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1. Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach;Micromachines;2023-07-27