Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling-Reference-Cited by-同舟云学术

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Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Pan Ke,Xu Jiefeng,Lai Yangyang,Park Seungbae,Okoro Chukwudi,Joshi Dhananjay,Pollard Scott

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501700.pdf?arnumber=9501700

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review;Microelectronics Reliability;2024-10

2. A review on warpage measurement metrologies for advanced electronic packaging;Microelectronics Reliability;2024-09

3. A comprehensive numerical analysis for preventing cracks in 2.5D glass interposer;Journal of Mechanical Science and Technology;2024-06

4. Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV);2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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