Effect of Temperature and Solder Thickness on Interfacial Reaction in Cu/Sn/Ni Solder Joints Formed by TLP Bonding
Author:
Affiliation:
1. Jiangsu University of Science and Technology,School of Materials Science and Engineering,Zhenjiang,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872676.pdf?arnumber=9872676
Reference5 articles.
1. The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering
2. Effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn/Ni solder joint;huang;The Chinese Journal of Nonferrous Metals,2013
3. Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures
4. Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars
5. Research progress on preparation a nd characterization of full IMC micro-joints;shi;The Chinses Journal of Nonferrous Metals in press,0
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