Research on mechanical reliability of multilayer packaging substrate based on build-up film-Reference-Cited by-同舟云学术

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Research on mechanical reliability of multilayer packaging substrate based on build-up film

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Chen Wenbo¹,Zhong Cheng²,Yu Junyi²,Yu Shuhui²,Luo Suibin²,Sun Rong²

Affiliation:

1. Southern University of Science and Technology,Shenzhen Institute of Advanced Technology, Chinese Academy of Science,Shenzhen,China

2. Chinese Academy of Science Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Shenzhen,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873161.pdf?arnumber=9873161

Reference6 articles.

1. Bill of material and geometry on FCBGA packaging warpage impacts

2. Application of numerical analysis to the reliability assessment of a novel package on package (PoP) structure for memory stacking

3. Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics

4. Warpage Estimation of Heterogeneous Panel-Level Fan-Out Package with Fine Line RDL and Extreme Thin Laminated Substrate Considering Molding Characteristics

5. Novel insulation materials suitable for FOWLP and FOPLP

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