Author:
Kao Kuo-Shu,Wu Sheng-Tsai,Hung Yin-Po,Chang Tao-Chih,Cheng Ren-Shin,Chen Tai-Hong
Cited by
1 articles.
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1. Research on mechanical reliability of multilayer packaging substrate based on build-up film;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10