An effective analytical method for the interface reliability design of System-in-Package in thermal environments
Author:
Affiliation:
1. Huawei Technologies Co., Ltd,Shenzhen,China
2. Huawei Device Co., Ltd,Dongguan,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872626.pdf?arnumber=9872626
Reference6 articles.
1. The Influence of Molding Compound Properties on System-in-Package Reliability for 5G Application
2. Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness
3. A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks
4. Mechanics and fracture of crack tip deformable bi-material interface
5. Energy release rate and stress intensity factors for delaminated composite laminates
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