The mechanical reliability design of thin-film encapsulation for laminated-based flexible organic light emitting diodes using semi-analytical method
Author:
Affiliation:
1. Huawei Technologies Co., Ltd,Shenzhen,PR China,518000
2. Huawei Device Co., Ltd,Dongguan,PR China,523808
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9948447/9948432/09948535.pdf?arnumber=9948535
Reference14 articles.
1. Reliable thin-film encapsulation of flexible OLEDs and enhancing their bending characteristics through mechanical analysis
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3. A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks
4. An effective analytical method for the interface reliability design of System-in-Package in thermal environments
5. A mechanically enhanced hybrid nano-stratified barrier with a defect suppression mechanism for highly reliable flexible OLEDs
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