Design of Three-layer Glass-based 3D Stacked Radio Frequency Transmission Structure
Author:
Affiliation:
1. Electronics Technology Group Corporation,The 29th Research Institute of China,Chengdu,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872692.pdf?arnumber=9872692
Reference6 articles.
1. Design and Demonstration of 2.5D Glass Interposers as a Superior Alternative to Silicon Interposers for 28 Gbps Signal Transmission
2. Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
3. 3D IC and RF SiPs
4. A TGV-based Antenna in Package for 5G mm-Wave Application
5. Fabrication of 3D microchannels for tissue engineering in photosensitive glass using NIR femtosecond laser radiation
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