Design and Demonstration of 2.5D Glass Interposers as a Superior Alternative to Silicon Interposers for 28 Gbps Signal Transmission-Reference-Cited by-同舟云学术

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Design and Demonstration of 2.5D Glass Interposers as a Superior Alternative to Silicon Interposers for 28 Gbps Signal Transmission

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Sawyer Brett,Chou Bruce C.,Tong Jialing,Vis William,Panayappan Kadappan,Deng Shuhui,Tournier Hugues,Sundaram Venky,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545544.pdf?arnumber=7545544

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration;Chemical Reviews;2024-06-07

2. Applications, materials, and fabrication of micro glass parts and devices: An overview;Materials Today;2023-06

3. Design of Three-layer Glass-based 3D Stacked Radio Frequency Transmission Structure;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. Hetero-Generous Integration Using Organic Interposer;Journal of The Japan Institute of Electronics Packaging;2019-08-01

5. Hardware Solutions for 5G Mobility;3D IC and RF SiPs;2018-03-31

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