Effect of Solder Shape on Crack Propagation Behavior of SAC305 Solder under Fast Thermal Shock
Author:
Affiliation:
1. Chongqing University of Technology,College of Materials Science and Engineering,Chongqing,China
2. Golden Dragon Precise Copper Tube Group Inc,Chongqing,China
Funder
National Natural Science Foundation of China
China Postdoctoral Science Foundation
Chongqing Municipal Education Commission
Chongqing University
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873199.pdf?arnumber=9873199
Reference7 articles.
1. Solder shape design and thermal stress/strain analysis of flip chip packaging using hybrid method;liu;International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458),2000
2. Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
3. Effect of Rapid Thermal Fatigue on Microstructure and Properties of Sn3. 0Ag0. 5Cu/Cu Solder Bumps;tian;2020 21st International Conference on Electronic Packaging Technology (ICEPT),2020
4. Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period
5. Fatigue cracking growth of SAC305 solder ball under rapid thermal shock
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