Long-term Reliability Evaluation of Internal Atmosphere on Sealed Packaged MEMS Devices-Reference-Cited by-同舟云学术

Long-term Reliability Evaluation of Internal Atmosphere on Sealed Packaged MEMS Devices

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Huang Xinlong¹,Dong Xianshan²,Zhou Bin²,Lai Canxiong²,Fu Yanlong³,Hu Youwang¹

Affiliation:

1. Central South University,College of Mechanical and Electrical Engineering,Changsha,China

2. No.5 Electronics Research Institute of the Ministry of Industry and Information Technology,Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,Guangzhou,China

3. Ordos Institute of Technology,Department of Information Engineering,Ordos,China

Funder

Fundamental Research Funds for the Central Universities

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872593.pdf?arnumber=9872593

Reference12 articles.

1. Non-evaporable getter films for vacuum packaging of MEMS devices: an overview;zhou;Material Reports,2019

2. High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

3. A review of the most important failure, reliability and nonlinearity aspects in the development of microelectromechanical systems (MEMS)

4. BGA substrate outgassing negative impact study on Cu wire bonding

5. Lifetime prediction method for MEMS gyroscope based on accelerated degradation test and acceleration factor model

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