Influence of material property of photosensitive polyimide on typical structural stress in redistribution layer of fan-out package-Reference-Cited by-同舟云学术

Influence of material property of photosensitive polyimide on typical structural stress in redistribution layer of fan-out package

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Lai Xingwang¹,Zhong Cheng¹,Yang Zixin¹,Xu Guangtao¹,Li Jinhui¹,Niu Fangfang¹,Zhang Guoping²

Affiliation:

1. Chinese Academy of Science,Shenzhen Institude of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

2. Shenzhen University,Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Physics and Optoelectronic Engineering,Shenzhen,China,518060

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873179.pdf?arnumber=9873179

Reference8 articles.

1. The Comparative Study of High and Low Temperature Cure Polyimide For Wafer Level Package With Ultra-Thick Re-distribution Copper Layer

2. Fan-Out (RDL-First) Panel-Level Hybrid Substrate for Heterogeneous Integration

3. A Viscoplastic-Based Fatigue Reliability Model for the Polyimide Dielectric Thin Film

4. A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package

5. Physical characteristics of polyimide films for flexible sensors

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3. Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08