Multimodality Driven Impedance-Based Sim2Real Transfer Learning for Robotic Multiple Peg-in-Hole Assembly-Reference-Cited by-同舟云学术

Multimodality Driven Impedance-Based Sim2Real Transfer Learning for Robotic Multiple Peg-in-Hole Assembly

Published:2023 Issue: Volume: Page:1-14
ISSN:2168-2267
Container-title:IEEE Transactions on Cybernetics
language:
Short-container-title:IEEE Trans. Cybern.

Author:

Chen Wenkai¹^ORCID,Zeng Chao¹^ORCID,Liang Hongzhuo¹^ORCID,Sun Fuchun²^ORCID,Zhang Jianwei¹^ORCID

Affiliation:

1. Department of Informatics, Technical Aspects of Multimodal Systems Group, Universität Hamburg, Hamburg, Germany

2. Department of Computer Science and Technology, Tsinghua University, Beijing, China

Funder

German Research Foundation

National Science Foundation of China (NSFC) through the Project Crossmodal Learning

through the Project DEXMAN

European Projects

Ultracept

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications,Human-Computer Interaction,Information Systems,Control and Systems Engineering,Software

Link

http://xplorestaging.ieee.org/ielx7/6221036/6352949/10251991.pdf?arnumber=10251991

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