Author:
Chen K. M.,Ho K. K.,Kuo P. C.,Wu C. Y.
Cited by
4 articles.
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1. Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
2. Prepreg-based FCBGA for Advanced Packaging Substrate;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03
3. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
4. Research on mechanical reliability of multilayer packaging substrate based on build-up film;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10