Challenges associated with diamond wire sawing when generating reduced thickness mono-crystalline silicon wafers
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7701171/7749395/07749697.pdf?arnumber=7749697
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of liquid bridge on the thickness deviation between wafers sawn by diamond wire;Journal of Manufacturing Processes;2023-12
2. Effect of the diamond saw wires capillary adhesion on the thickness variation of ultra-thin photovoltaic silicon wafers during slicing;Solar Energy Materials and Solar Cells;2023-10
3. Magnetic-field-assisted abrasive sensing and its deployment in electroplated diamond cutting wires;The International Journal of Advanced Manufacturing Technology;2023-09-26
4. Fabrication of Crystalline Si Thin Films for Photovoltaics;physica status solidi (RRL) – Rapid Research Letters;2022-10-07
5. Impact of PECVD-prepared interfacial Si and SiGe layers on epitaxial Si films grown by PECVD (200 °C) and APCVD (1130 °C);Applied Surface Science;2021-04
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