Magnetic-field-assisted abrasive sensing and its deployment in electroplated diamond cutting wires
Author:
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Link
https://link.springer.com/content/pdf/10.1007/s00170-023-12295-z.pdf
Reference20 articles.
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2. Chung C, Tsay GD, Tsai MH (2014) Distribution of diamond grains in fixed abrasive wire sawing process. Int J Adv Manuf Technol 73:1485–1494. https://doi.org/10.1007/s00170-014-5782-y
3. Ho C-C, Deng Y-Z, Tsai B-E, Kuo C-LJ (2022) Study on magnetic-field-based abrasive grains patterning for electroplating diamond wire saws. J Laser Appl 34:022006. https://doi.org/10.2351/7.0000552
4. Kray D, Schumann M, Eyer A, Willeke GP, Kubler R, Beinert J, Kleer G (2006) Solar wafer slicing with loose and fixed grains. In: 2006 IEEE 4th World Conference on Photovoltaic Energy Conference. IEEE, pp 948–951. https://doi.org/10.1109/WCPEC.2006.279613
5. Kumar A, Melkote SN (2017) The chemo-mechanical effect of cutting fluid on material removal in diamond scribing of silicon. Appl Phys Lett 111:011901. https://doi.org/10.1063/1.4991536
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