Thin-film silicon solar cells using an adhesive bonding technique
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/16/20433/00944200.pdf?arnumber=944200
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. From Rigid to Flexible: Progress, Challenges and Prospects of Thin c‐Si Solar Energy Devices;Advanced Energy Materials;2024-05-08
2. Initiated Chemical Vapor Deposition of polysiloxane as adhesive nanolayer for silicon wafer bonding;Materials Science in Semiconductor Processing;2022-09
3. Polymer Bonding;3D and Circuit Integration of MEMS;2021-04-23
4. Fabrication of capacitive micromachined ultrasonic transducers based on adhesive wafer bonding technique;Journal of Micromechanics and Microengineering;2016-10-18
5. Performance analysis of a solar-powered solid state heat engine for electricity generation;Energy;2015-12
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