Polymer Bonding

Author:

Wang Xiaojing,Niklaus Frank

Publisher

Wiley

Reference67 articles.

1. 3‐D hyperintegration and packaging technologies for micro‐nano systems;Lu J.‐Q.;Proc. IEEE,2009

2. McMahon J.J. Niklaus F. Kumar R.J.et al. (2005).CMP compatibility of partially cured benzocyclobutene (BCB) for a via‐first 3D IC process. Proceedings MRS 2005 Vol. 863 W4.4 San Francisco USA.

3. Adhesive wafer bonding using partially cured benzocyclobutene (BCB) for three‐dimensional integration;Niklaus F.;J. Electrochem. Soc.,2006

4. Dragoi V. Filbert A. Zhu S. andMittendorfer G.(2010).CMOS wafer bonding for back‐side illuminated image sensors fabrication. Proceedings IEEE 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Xi'an China 27–30.

5. Pain B. Sun C. Vo P.et al.2007.Wafer‐level thinned monolithic CMOS imagers in a bulk‐CMOS technology. Proc. International Image Sensor Workshop Proceedings 158–161.

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Wafer-scale adhesive bonding with hard Benzocyclobutene anchors for wafer assembly and heterogeneous integration;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

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