Copper Nanowired Interconnection for Embedding Power Dies in PCB
Author:
Affiliation:
1. Mitsubishi Electric R&D Centre,Rennes,France
2. University of Toulouse,Toulouse,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10361838/10361943/10362755.pdf?arnumber=10362755
Reference18 articles.
1. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
2. Wide band gap semiconductor technology: State-of-the-art
3. Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development
4. New power module concept in PCB-embedded technology with silver sintering die attach
5. Design and evaluation of a building block for a 100kw dc/dc converter based on pcb process;Morand
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