New power module concept in PCB-embedded technology with silver sintering die attach-Reference-Cited by-同舟云学术

New power module concept in PCB-embedded technology with silver sintering die attach

Published:2020-11 Issue: Volume:114 Page:113891
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Tablati A.,Alayli N.,Youssef T.,Belnoue O.,Theolier L.,Woirgard E.

Funder

Agence Nationale de la Recherche

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Embedded components for high temperature automotive applications;Grübl,2018

2. Development of High-power Density Inverter for Automotive Applications;Hyon,2018

3. D. Kearney, S. Kicin, E. Bianda, A. Krivda, D. Bauman "PCB embedded power electronics for low voltage applications", In CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems, pp. 3–8.

4. Characteristics and aging of PCB embedded power electronics;Randoll;Microelectron. Reliab.,2015

5. Characterization of PCB embedded package materials for SiC MOSFETs;Hou;IEEE TCPMT,2019

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