Warpage control of silicon interposer for 2.5D package application-Reference-Cited by-同舟云学术

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Warpage control of silicon interposer for 2.5D package application

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Murayama Kei,Aizawa Mitsuhiro,Hara Koji,Sunohara Masahiro,Miyairi Ken,Mori Kenichi,Charbonnier Jean,Assous Myriam,Bally Jean-Philippe,Simon Gilles,Higashi Mitsutoshi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575677.pdf?arnumber=6575677

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges;Journal of Electronic Packaging;2024-01-08

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4. Reliability Challenges of Large Organic Substrate with High-Density Fan-out Package;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Development of a Silicon Interposer: Toward an Ultralow Radioactivity Background Photodetector System;IEEE Transactions on Nuclear Science;2023-02

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