Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Author:
Affiliation:
1. Microperipheric Research Center, Technical University Berlin (TUB)
2. Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin Gustav-Meyer-Allee 25, Berlin 13355, Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5482824/5490635/05490733.pdf?arnumber=5490733
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