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Engineered thermal interface material

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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Author:

Larson Lyndon,Tang Yin,Durfee Loren,Hale Cassandra,Plante David,Iruvanti Sushumna,Wagner Rebecca,Davis Taryn,Longworth Hai,Lavoie Annique,Langois Richard

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897294.pdf?arnumber=6897294

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-melting metal thermal interface material for high-power package application;Journal of the Korean Physical Society;2023-07-28

2. Study of Solder Resist Crack Resistance for Flip Chip Ball Grid Array Substrate;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Stretchable Thermal Interface Materials by Tailoring the Chain Relaxation at the Filler/Polymer Interface;ACS Applied Polymer Materials;2022-06-06

4. Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

5. A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications;Journal of Electronic Materials;2019-09-18

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