SACQ Solder Board Level Reliability Evaluation and Life Prediction Model for Wafer Level Packages-Reference-Cited by-同舟云学术

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SACQ Solder Board Level Reliability Evaluation and Life Prediction Model for Wafer Level Packages

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Lin Wei,Pham Quan,Baloglu Bora,Johnson Michael

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999816.pdf?arnumber=7999816

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Bayesian calibration of ball grid array lifetime models for solder fatigue;Microelectronics Reliability;2024-04

3. Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

4. Design Optimization to Boost Solder Joint Reliability Performance for SSD BGA Package;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

5. Enhancement of Thermal cycle and Drop Shock Reliability at Board Level with Developed Solder Composition by Optimized Bi, Cu, Ni Contents in Lead Free Solder Composition;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

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