1. Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps with $5\ \mu \mathrm{m}$ Diameters;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Novel plasma process for build-up film in the fine wiring fabrication;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Fan-In Wafer/Panel-Level Chip-Scale Packages;Semiconductor Advanced Packaging;2021
4. Panel-Level Chip-Scale Package With Multiple Diced Wafers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-07
5. Fan-In Panel-Level with Multiple Diced Wafers Packaging;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06