A study on an Ultra Thin PoP using through mold via technology-Reference-Cited by-同舟云学术

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A study on an Ultra Thin PoP using through mold via technology

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
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Author:

Yoshida Akito,Wen Shengmin,Lin Wei,Kim JaeYun,Ishibashi Kazuo

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5871442/5898472/05898716.pdf?arnumber=5898716

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A design of vertical interconnections for the T/R module with PoP 3D packaging based on the replacing material of RT6002 substrate;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

2. Additively Manufactured “Smart” RF/mm-Wave Packaging Structures: A Quantum Leap for On-Demand Customizable Integrated 5G and Internet of Things Modules;IEEE Microwave Magazine;2022-08

3. Reliability Design and Optimization Process on through Mold via using Ultrafast Laser;Polymers and Polymer Composites;2018-01

4. Investigation on drilling blind via of epoxy compound wafer by 532 nm Nd:YVO 4 laser;Journal of Manufacturing Processes;2017-06

5. Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate;Microelectronics Reliability;2016-10

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