Assembly challenges in developing 3D IC package with ultra high yield and high reliability

Author:

Chaware Raghunandan,Hariharan Ganesh,Lin Jeff,Singh Inderjit,O'Rourke Glenn,Ng Kenny,Pai S. Y.,Li Chien-Chen.,Huang Zill,Cheng S. K.

Publisher

IEEE

Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Using statistical models for optimal packaging in semiconductor manufacturing processes;Journal of the Korean Statistical Society;2024-08-07

2. Zoomie: A Software-like Debugging Tool for FPGAs;Proceedings of the 29th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3;2024-04-27

3. Volumetric nondestructive metrology for 3D semiconductor packaging: A review;Measurement;2024-02

4. Direct Die to Wafer Cu Hybrid Bonding for Volume Production;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

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