Author:
Liu Hung-Wen,Liu Yi-Wei,Ji Jason,Liao Jash,Chen Agassi,Chen Yan-Heng,Kao Nicholas,Lai Yi-Che
Cited by
47 articles.
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1. Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Perspective on Plasma Etching in Advanced Packaging;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
3. Development and Demonstration on Process-Oriented Warpage Simulation Methodology of Fan-Out Panel-Level Package in Multilevel Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12
4. High toughness of nanotwinned copper lines after annealing;Materials Science and Engineering: A;2023-11
5. Research on Optimized Modeling of Package Warping Phenomenon;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08