Reliability Study of Large Fan-Out BGA Solution on FinFET Process-Reference-Cited by-同舟云学术

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Reliability Study of Large Fan-Out BGA Solution on FinFET Process

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Yu C.K.,Chiang W.S.,Huang P.S.,Lin M.Z.,Fang Y.H.,Lin M.J.,Peng Cooper,Lin Benson,Huang Michael

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429758.pdf?arnumber=8429758

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Plasma Treatment on Ni-Plated Copper as a Heat Spreader for fcBGA-H Device;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

2. Reliability Challenges of Large Organic Substrate with High-Density Fan-out Package;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Impact of warpage on signal delivery with large size FC-PBGA package;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

4. Comprehensive Investigation on Warpage Management of FOPLP with Multi Embedded Ring Designs;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

5. Hybrid Approach for Large Size FC-BGA to Enhance Thermal and Electrical Performance Including Power Delivery;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

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