Performance analysis of single- and multi-walled carbon nanotube based through silicon vias-Reference-Cited by-同舟云学术

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Performance analysis of single- and multi-walled carbon nanotube based through silicon vias

Published:2015-05 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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Author:

Alam Arsalan,Majumder Manoj Kumar,Kumari Archana,Kumar Vobulapuram Ramesh,Kaushik Brajesh Kumar

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159849.pdf?arnumber=7159849

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applying the high-k dielectric materials in vertical multilayer graphene nanoribbon (V-MLGNR) based interconnect for improving transmission performance;Micro and Nanostructures;2024-09

2. Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint;Microelectronic Engineering;2024-07

3. Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic;ECS Journal of Solid State Science and Technology;2022-03-01

4. An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power;Journal of Computational Electronics;2021-09-27

5. Dielectric surface roughness scattering induced crosstalk performance of coupled MCB interconnects;Microelectronics Journal;2021-08

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