Author:
Bao Andy,Cui Tong,Syed Ahmer,Zhao Lily,Bezuk Steve
Cited by
2 articles.
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1. Flip Chip Process Enablement in IC Memory Stacked Die Package;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Ultra Fine Pitch / Low Cost FCCSP Package and Chip Package Interaction (CPI) for Advanced CMOS Nodes;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05