Author:
Yoon Seung Wook,Tang Patrick,Emigh Roger,Lin Yaojian,Marimuthu Pandi C.,Pendse Raj
Cited by
51 articles.
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1. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
2. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
3. Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09
4. Hybrid Substrates for Heterogeneous Integration;Journal of Electronic Packaging;2023-08-11
5. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23