Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions-Reference-Cited by-同舟云学术

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Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Yoon Seung Wook,Tang Patrick,Emigh Roger,Lin Yaojian,Marimuthu Pandi C.,Pendse Raj

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575830.pdf?arnumber=6575830

Cited by 51 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

2. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

3. Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

4. Hybrid Substrates for Heterogeneous Integration;Journal of Electronic Packaging;2023-08-11

5. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23

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