Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429802.pdf?arnumber=8429802
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The application of Developing Low-warpage Bonding Pair by Finite Element Analysis;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31
3. Optimization of Temporary Carrier Technology for HDFO Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
4. Development of Self-releasing adhesive tape as a temporary bonding material for 3D integration;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging;Journal of Electronic Packaging;2019-05-17
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