Author:
Ueno Kenichi,Dohi Kazuhiro,Suzuki Yui,Hirose Masakazu
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11
2. Ultra-thin mold cap for Advanced Packaging Technology;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Fan-In Wafer/Panel-Level Chip-Scale Packages;Semiconductor Advanced Packaging;2021
4. Panel-Level Chip-Scale Package With Multiple Diced Wafers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-07
5. Fan-In Panel-Level with Multiple Diced Wafers Packaging;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06