Effects of reliability testing methods on microstructure and strength at the Cu wire-Al pad interface
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IEEE
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http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575569.pdf?arnumber=6575569
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications;Microelectronics Reliability;2020-10
2. Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05
3. Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-04
4. Evolution and investigation of copper and gold ball bonds in extended reliability stressing;Gold Bulletin;2014-03-29
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