Author:
Podpod Arnita,Phommahaxay Alain,Bex Pieter,Slabbekoorn John,Bertheau Julien,Salahoueldhadj Abdellah,Sleeckx Erik,Miller Andy,Beyer Gerald,Beyne Eric,Guerrero Alice,Yess Kim,Arnold Kim
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. The application of Developing Low-warpage Bonding Pair by Finite Element Analysis;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31
3. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Chiplets Lateral Communications;Chiplet Design and Heterogeneous Integration Packaging;2023
5. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021