Author:
Xie Mayue,Begala Tom,Kijkanjanapaiboon Kasemsak,Goyal Deepak
Cited by
4 articles.
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1. Thermal simulations of lock-in-thermography for failure analysis of integrated circuits;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
2. Fault localization of IDDQ failure using External trigger Synchronous LIT technique;2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2020-07-20
3. Effect of Interaction Between Multiple Defects on Z-Depth Estimate in Lock-in Thermography Applications;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05
4. Investigation of Multiple Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-05