All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering-Reference-Cited by-同舟云学术

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All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Zurcher Jonas,Carro Luca Del,Schlottig Gerd,Wright Daniel Nilsen,Vardoy Astrid-Sofie B.,Taklo Maaike M. Visser,Mills Tobias,Zschenderlein Uwe,Wunderle Bernhard,Brunschwiler Thomas

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545454.pdf?arnumber=7545454

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review of Die-Attach Materials for SiC High-Temperature Packaging;IEEE Transactions on Power Electronics;2024-10

2. Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration;Microelectronics Reliability;2023-11

3. Patterned Cu Nanoparticle Film for All-Cu Interconnection Without Chemical Mechanical Polishing Pretreatment;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05

4. Microstructural evolution, fracture behavior and bonding mechanisms study of copper sintering on bare DBC substrate for SiC power electronics packaging;Journal of Materials Research and Technology;2022-07

5. Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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