3D Printing as a New Packaging Approach for MEMS and Electronic Devices-Reference-Cited by-同舟云学术

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3D Printing as a New Packaging Approach for MEMS and Electronic Devices

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Aspar G.,Goubault B.,Lebaigue O.,Souriau J-C.,Simon G.,Di Cioccio L.,Brechet Y.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999818.pdf?arnumber=7999818

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Polymeric piezoelectric accelerometers with high sensitivity, broad bandwidth, and low noise density for organic electronics and wearable microsystems;Microsystems & Nanoengineering;2024-05-15

2. Additive Manufacturing Electronics for Packaging High-Frequency Aluminum Nitride Piezoelectric Micromachined Ultrasonic Transducer Probes;Eurosensors 2023;2024-03-18

3. Suppression of the height deviation on metal bumps manufacturing by an ultrasonic vibration control;Ultrasonics;2024-03

4. 3D Printed Multifunctional Polymeric Nanocomposite Components With Sensing Capability;IEEE Access;2023

5. High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

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