Author:
Hwang Taejoo,Oh Dan,Song Eunseok,Kim Kilsoo,Kim Jaechoon,Lee Seokwon
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
3. Advanced Fan-Out Panel Level Package (FO-PLP) Development for High-end Mobile Application;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Design space exploration (DSE) for over-136GB/s IO bandwidth with LPDDR5X SDRAM packages on SOC package in 200mm3;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023